Semiconductor & Electronics · Category 05
Semiconductor Packaging & Electronic Assembly Materials
Lead-free solders, encapsulation and die-attach materials, bonding wire, thermal-interface materials, conformal coatings and conductive films for chip packaging and electronics assembly.
Product Range
Product families and products
Specifications, grades, packaging, documentation and lead times are confirmed with each quotation. Supply is subject to regulatory and trade requirements.
Product families
- Lead-Free Solders
- Encapsulation, Underfill & Die-Attach
- Bonding Wire
- Thermal-Interface Materials
- Conformal Coatings & Conductive Films
Products
- SAC305 Solder AlloyView product
- Lead-Free Solder PasteView product
- Lead-Free Solder WireView product
- Lead-Free Solder BarView product
- SAC0307 Solder AlloyView product
- Tin-Bismuth Solder AlloyView product
- Solder BallView product
- Epoxy Molding CompoundView product
- Underfill EpoxyView product
- Die-Attach EpoxyView product
- Silver Sintering PasteView product
- Copper Bonding WireView product
- Gold Bonding WireView product
- Aluminum Bonding WireView product
- Thermal GreaseView product
- Thermal Conductive PadView product
- Thermally Conductive Electronic AdhesiveView product
- Silicone Conformal CoatingView product
- Acrylic Conformal CoatingView product
- Anisotropic Conductive FilmView product
Product Portfolio
More Semiconductor & Electronics categories
High-Purity Chemicals
Electronic-grade acids, bases, solvents, etchants and strippers.
Process & Specialty Gases
Bulk gases, etch and chamber-cleaning gases, deposition precursors and rare gases.
Wafers & Substrates
Silicon, SOI, silicon carbide and compound-semiconductor wafers and feedstock.
Photoresists & CMP
Photoresists, developers, resist raw materials, CMP slurries, pads and precursors.
